Low Cost Packaged FETs

Low Cost Packages Amplifiers ModelPackage Available Sealed / HermeticGate Width / Length umGate Layout MethodGate Drain Source Bond Pads QtyChip Thick-ness & VIA Hole mil, y/nS.S. Gain @12GHz Typ/Max dBN.F. @12Ghz Typ/Max dBGa @ N.F @12GHz Typ/Min dBP-1dB @12GHz Typ dBmIP3 @12GHz Typ dBmNominal Chip Size um - umIde...